JPH0713196Y2 - 電気接続子 - Google Patents
電気接続子Info
- Publication number
- JPH0713196Y2 JPH0713196Y2 JP1989128810U JP12881089U JPH0713196Y2 JP H0713196 Y2 JPH0713196 Y2 JP H0713196Y2 JP 1989128810 U JP1989128810 U JP 1989128810U JP 12881089 U JP12881089 U JP 12881089U JP H0713196 Y2 JPH0713196 Y2 JP H0713196Y2
- Authority
- JP
- Japan
- Prior art keywords
- slit
- conductor
- film
- base
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 59
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 230000001012 protector Effects 0.000 claims description 7
- 210000002105 tongue Anatomy 0.000 description 23
- 238000002788 crimping Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128810U JPH0713196Y2 (ja) | 1989-11-01 | 1989-11-01 | 電気接続子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128810U JPH0713196Y2 (ja) | 1989-11-01 | 1989-11-01 | 電気接続子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0366193U JPH0366193U (en]) | 1991-06-27 |
| JPH0713196Y2 true JPH0713196Y2 (ja) | 1995-03-29 |
Family
ID=31676485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989128810U Expired - Lifetime JPH0713196Y2 (ja) | 1989-11-01 | 1989-11-01 | 電気接続子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713196Y2 (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8873011B2 (en) | 2000-03-16 | 2014-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method of manufacturing the same |
| US9099355B2 (en) | 2000-03-06 | 2015-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2149932B1 (en) * | 2007-12-26 | 2014-05-14 | Onamba Co., Ltd. | Terminal plate circuit using pushing member |
| JP5406843B2 (ja) * | 2009-07-27 | 2014-02-05 | オーナンバ株式会社 | 端子板回路 |
| EP2503642A1 (en) * | 2010-04-07 | 2012-09-26 | Onamba Co., Ltd. | Terminal strip circuit |
| KR101860712B1 (ko) * | 2017-12-08 | 2018-05-24 | 이규원 | 찔림방지 주사기 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0230073A (ja) * | 1988-04-07 | 1990-01-31 | Yazaki Corp | 平型導体ケーブル用電気接続子 |
-
1989
- 1989-11-01 JP JP1989128810U patent/JPH0713196Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9099355B2 (en) | 2000-03-06 | 2015-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
| US8873011B2 (en) | 2000-03-16 | 2014-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0366193U (en]) | 1991-06-27 |
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